Rice University

Shared Equipment Authority

Nanofab Characterization Room: Flip-Chip Die Bonder (Fineplacer Lambda)

Location: 
Shared Characterization Lab (Abercrombie A167)

USAGE OF THIS INSTRUMENT IS NOW LOGGED EXCLUSIVELY THROUGH FOM: https://fom.rice.edu/fom/

 The die bonder is a walk-up tool; no reservation required.

The Fineplacer Lmabda is a flip-chip die bonder made by Finetech and is used for precise placement of dies and components for bonding to device substrates. It can provide sub-micron placement accuracy and can accommodate custom tooling for handling a variety of materials. Standard tooling for the instrument is capable of handling dies as small as 2-3 mm and substrates up to 50 mm square. A heated stage and a heated placement tool option are available to facilitate bonding processes. This instrument is not currently reservable (walk-up usage by qualified persons welcome), but that may change if demand for it increases sufficiently.

Notifications: 
This is a closed group. Only a group administrator can add you.
This is a closed group. Only a group administrator can add you.
Use Prime hours: 
No
Max Weekly Hours: 
0
Max Daily Hours: 
0
Training Contact: 
Tim Gilheart, SEA Cleanroom Manager (gilheart-at-rice.edu)
Rice U Fee: 
$15/use
Non-Commercial / Academic Fee: 
$23.50 / use
Corporate / Commercial Fee: 
$75 / use
Maintenance: