THIS INSTRUMENT IS NOW SCHEDULED EXCLUSIVELY THROUGH FOM: https://fom.rice.edu/fom/
The EVG 620 system offers robust semi-automatic photolithography processing for substrates ranging from small dies/pieces to 4" wafers and for masks either 4" or 5" square.
Includes automatic WEC, multiple contact modes (soft, hard, vac, vac+hard), several exposure modes (including proximity and large gap), as well as both topside and backside optics to accomodate numerous alignment needs.
Additionally, a manually-instered filter for use with certain SU-8 resist processes is available (Omega Optical PL-360LP).
Off-center work with small dies can be accommodated using an ad hoc solution; contact cleanroom manager for further details.