SEA supports and provides state-of-the-art research equipment capabilities for Rice University and the extended Rice community.
We provide sophisticated research equipment and facilities to all members of the Rice University community, as well as support and open instrumentation usage to outside companies, nano/bio/enviro start-ups and other universities upon availability.
We support more than 65 instruments.
SEA offers training and support for all of our state-of-the-art research equipment.
Description of brand new SEA cleanroom
Out of cleanroom computer workstation for various applications
Conformal coating with inert biocompatible polymer
Machine acrylic and non-metallic materials
Ultrasonic wedge bonding with fine gold wire
High resolution 2D and 3D printing
Compact high vacuum sputtering system for physical vapor deposition
Thermal, conformal deposition of oxides
Supercritical drying of MEMS devices and materials
Contact film step height and surface roughness measurement
Cutting thin semiconductor, glass, and quartz materials
Precision placement and bonding with controlled heating
E-beam evaporation of metals, magnetics, dielectrics
High speed, ultra high precision thermal field emission (TFE) electron beam lithography system
Optical thin film thickness and optical property measurement
Scanning Electron Microscope (SEM) that produces enlarged images of a variety of specimens, achieving magnification over 100,000X
Thermal evaporation of metals (primarily Ag, Al)
Contact photolithography; micron-scale resolution
Non-contact maskless photolithography system with different wavelength LED light sources, micron-scale resolution
Non-contact 3D surface measurements including thickness and surface topographies
Deep etching through the use of Bosch and/or cryogenic processes
Variable power (<300 W) oxygen and/or argon plasmas
This instrument is dead. A new PECVD will be purchased in the near future.
Rapid thermal process for samples up to 6” wafer
Optical thin film thickness measurement
Photoresists, PDMS, and spin-on materials
Polishing wafers, chips, dies, and other pieces