Precision placement and bonding with controlled heating
USAGE OF THIS INSTRUMENT IS NOW LOGGED EXCLUSIVELY THROUGH FOM: https://fom.rice.edu/fom/ The die bonder is a walk-up tool; no reservation required. The Fineplacer Lmabda is a flip-chip die bonder made by Finetech and is used for precise placement of dies and components for bonding to device substrates. It can provide sub-micron placement accuracy and can accommodate custom tooling for handling a variety of materials. Standard tooling for the instrument is capable of handling dies as small as 2-3 mm and substrates up to 50 mm square. A heated stage and a heated placement tool option are available to facilitate bonding processes. This instrument is not currently reservable (walk-up usage by qualified persons welcome), but that may change if demand for it increases sufficiently.